Heat dissipation device with good appearance

ABSTRACT

A heat dissipation device for a heat-generating component includes a heat dissipation fin group and a side plate. The heat dissipation fin group comprises a plurality of heat dissipation fins arranged one on the other, each of the heat dissipation fins comprises a base plate and a fold extending vertically from a side of the base plate. The folds of the heat dissipation fins located at a common side are combined with each other to form a side surface. The side plate covers the side surface of the heat dissipation fin group, and an exposed surface of the side plate includes a plurality of strips formed thereon.

BACKGROUND

1. Technical Field

The disclosure generally relates to heat dissipation, and particularly to a heat dissipation device containing many heat dissipation fins with good appearance.

2. Description of Related Art

It is well known that heat is generated by electronic components, such as integrated circuit chips, during their operation. If the heat is not efficiently removed, the electronic components may suffer damage. Thus, heat dissipation devices are often used to cool the electronic components.

As shown in FIG. 6, a typical heat dissipation device 200 is consisted of several heat dissipation fins 30 arranged one on the other, and each heat dissipation fin 30 includes a main body 31 and two folds 32 extending vertically from two opposite sides of the main body 31. The folds 32 of the heat dissipation fins 30 located on a common side of the heat dissipation device 200 are arranged continuously to cooperatively form a side surface 40. However, in manufacture, a great color difference or a larger gap formed between two adjacent heat dissipation fins 30, resulting in a bad appearance for the side surface 40. Specially, when the heat dissipation device 200 have many heat dissipation fins 30, the quality for the side surface 40 formed by the folds 32 of the heat dissipation fins 30 usually can not meet the demand of the practical application.

What is needed, therefore, is a heat dissipation device with good appearance which can overcome the described limitations.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the various views.

FIG. 1 is an assembled view of a heat dissipation device in accordance with a first embodiment of the disclosure.

FIG. 2 is an exploded, isometric view of the heat dissipation device of FIG. 1.

FIG. 3 is an assembled view of a heat dissipation device in accordance with a second embodiment of the disclosure.

FIG. 4 is an isometric view of an unassembled side plate of the heat dissipation device in FIG. 3.

FIG. 5 is a reversed view of the side plate with non-bended hook in FIG. 4.

FIG. 6 is an assembled view of a typical heat dissipation device.

DETAILED DESCRIPTION

Referring to FIGS. 1 and 2, a heat dissipation device 100 in accordance with a first embodiment of the disclosure is shown. The heat dissipation device 100 dissipates heat generated by a heat-generating electronic component (not shown), such as a central processing unit (CPU) or other components. The heat dissipation device 100 includes a heat dissipation fin group 10 which is consisted of a plurality of heat dissipation fins 11 arranged one on the other and two side plates 20 located at two opposite sides of the heat dissipation fins 11.

The heat dissipation fins 11 are made of metal or metal alloy with a high heat conductivity coefficient, such as copper, copper-alloy, or other suitable material. Each of the heat dissipation fins 11 includes a base plate 111 and two folds 112 extending vertically from two opposite sides of the base plate 111. In the present embodiment, the base plate 111 is generally rectangular, and the folds 112 are elongated strips. The folds 112 located at a common side are combined with each other by jointing to form a side surface 12, therefore, a strip/connecting line can be formed between two adjacent folds 112. For integrated view of the side surface 12, a picture contains many substantially horizontal lines is defined thereon. It can be understood that, the base plate 111 and the folds 112 may be other shapes so long as the folds 112 can cooperatively form an integrated side surface. The folds 112 located at a common side may be combined with each other by other method, such as clasping, agglutinating etc, but a picture consisted of many strips must be defined thereon. Each heat dissipation fin 11 may include only one fold 112 extending vertically from a side of the base plate 111, the folds 112 of the heat dissipation fins 11 which are located at the common side must cooperatively form an integrated side surface.

The side plate 20 is rectangular, and an area of the side plate 20 is substantially equal to that of the side surface 12 of the heat dissipation fin group 10. The side plate 20 is made of the same material as the heat dissipation fin 11, and coupled to the side surface 12 of the heat dissipation fin group 10 by jointing. Especially, a surface of the side plate 20 has many strips similar to that of the side surface 12. Particularly, a shape of each strip and the arrangement for the strips are corresponding to/the same as that of the side surface 12. Therefore, the side plate 20 covers the side surface 12 of the heat dissipation fin group 10, the appearance of the heat dissipation fin group 10 can be replaced by the side plate 20, that is a satisfactory appearance can be shown by the side plate 20 no matter what the actual appearance of the heat dissipation fin group 10 is. Finally, the appearance of the heat dissipation device 100 is no longer limited by the side surface 12 of the heat dissipation fin group 10, while the side plate 20 with better appearance is easy to manufacture, so the appearance quality for the heat dissipation device 100 can be improved and securing the design for the heat dissipation device 100 meet the original demand.

Referring to FIGS. 3 and 4, a heat dissipation device 100 a, in accordance with a second embodiment, is provided. The heat dissipation device 100 a is similar to that of the first embodiment except that a side plate 20 a includes a main body 21 a and a plurality of L-shaped hooks 22 a extending outwardly from two opposite edges of the main body 21 a. The hooks 22 a are corresponded to couple with the folds 112 of the heat dissipation fins 11. A distance between two adjacent hooks 22 a may be equal to a width of a corresponding fold 112 of the heat dissipation fin 11.

Referring to FIG. 5, a side plate 20 a before assembled to the fins 11 is shown. In such a state, the plurality of non-bended hooks 22 a extend perpendicularly outwards from two opposite edges of the main body 21 a, and a planar surface of the main body 21 a defines a picture consisted of a number of substantially horizontal strips. Referring to FIGS. 2 and 5, when the side plate 20 a is assembled onto the heat dissipation fin group 10, attaching the side plate 20 a onto the side surface 12 of the heat dissipation fin group 10 and aligning the non-bended hooks 22 a of the side plate 20 a with the fold 112 of the heat dissipation fin 11, bending the hooks 22 a of the side plate 20 a into the heat dissipation fin group 10 thereby the hooks 22 a clasping the folds 112 of the heat dissipation fins 11 respectively. Finally, the side plate 20 a holds on the heat dissipation fin group 10 to cover the side surface 12 of the heat dissipation fin group 10, the picture defined on the planar surface of the main body 21 a is viewed as shown. The appearance of the heat dissipation device 100 a is good or not is limited by the side surface of the heat dissipation fin group 10, while the side plate 20 a with better appearance is easy to manufacture. Therefore, the appearance quality for the heat dissipation device 100 a can be improved and securing the design for the heat dissipation device 100 a meet the original demand.

It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed. 

1. A heat dissipation device for a heat-generating component, the heat dissipation device comprising: a heat dissipation fin group comprising a plurality of heat dissipation fins arranged one on the other, each of the heat dissipation fins comprising a base plate and a fold extending vertically from a side of the base plate, the folds of the heat dissipation fins located at a common side combined with each other to form a side surface; and a side plate covering the side surface of the heat dissipation fin group, an exposed surface of the side plate comprising a plurality of strips formed thereon.
 2. The heat dissipation device of claim 1, wherein the strips of the exposed surface of the side plate are corresponding to connecting lines between the adjacent folds of the heat dissipation fins.
 3. The heat dissipation device of claim 1, wherein the exposed surface is consisted of a plurality of substantially horizontal lines.
 4. The heat dissipation device of claim 1, wherein the base plate is rectangular and the folds are elongated strips.
 5. The heat dissipation device of claim 1, wherein an area of the exposed surface of the side plate is equal to that of the side surface of the heat dissipation fin group.
 6. The heat dissipation device of claim 1, wherein the side plate is made of the same material with the heat dissipation fin.
 7. The heat dissipation device of claim 1, wherein the side plate comprises a main body and a plurality of L-shaped hooks extending outwardly from two opposite edges of the main body, the hooks are corresponded to couple with the fold of the heat dissipation fin. 